Global SMT & Packaging

Global SMT Podcast

News EN ↓ Odcinki: 349

Global SMT & Packaging APP, BLOG, PODCAST, Websites, Newsletters, Magazines, Videos and Social Media platforms (Facebook, Twitter, Linkedin, YouTUBE) are a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials, 3D Printing, SMT – Surface Mount Technology, OTS – Open Technology Solutions, SFS – Smart Factory Solutions, IPC – Institute for Printed Circuits. These sources also give you exclusive access to CEO interviews, webinars, white papers, new products, panel discussi...

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Global SMT & Packaging

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www.globalsmt.net

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30 paź 2026

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Heller Tackles Voiding with Vacuum and Formic Acid 30.10.2026

Keith Bryant speaks with Laurino Lopez and Emmanuel Sanchez of Heller Industries about growing demand for vacuum and nitrogen reflow as electronics manufacturers work to reduce solder voiding. The team highlights vacuum reflow technology, the shift towards longer ovens with more heating zones, and the importance of controlled cooling. They also discuss Heller’s fluxless formic acid reflow process,...

Availability First: Anda’s Conformal Coating Strategy in Mexico 29.10.2026

Keith Bryant spoke with Carlos of Anda Technologies about fast delivery, precision coating and local support. Anda can deliver a complete production line within a week and plans to stock 28 machines in Mexico by year-end. Its coating systems combine jetting, piezoelectric and spray valves to reduce masking and manual rework, while an 800 m² Mexican facility provides service engineers and spare par...

Scaling Service to Match Rapid Change 28.10.2026

How is SMarTsol keeping pace with the changing needs of electronics manufacturers? At SMTA Guadalajara, Keith Bryant speaks with Julio Romo, newly appointed to SMarTsol’s senior management team, about the company’s expansion into Texas and Asia—and its investment in demo rooms, warehouses and service engineers closer to customers. With 15 years in the industry, SMarTsol is extending its capabiliti...

Rehm Condenso XC: Even Heating for Complex PCBs 27.10.2026

Keith Bryant spoke with Luis Garcia of Rehm about the Condenso XC, an entry-level vapour phase soldering machine designed for labs and small, high-mix production batches. PCBs combining large thermal masses with small, sensitive components can be difficult to reflow evenly. The Condenso XC uses Galden vapour to transfer heat efficiently, with temperature limited by the fluid’s boiling point. Two i...

KYZEN Targets Lower Cleaning Costs with Smarter Process Control 26.10.2026

Keith Bryant spoke with Luis Fernando Gazcon of KYZEN about new tools designed to improve cleaning efficiency and traceability. Its cost-modelling tool analyses inline and batch cleaning processes to identify ways to reduce water and chemical consumption, shorten cleaning cycles and extend bath life. KYZEN’s PCS closed-loop system measures concentration and automatically adds water or chemistry as...

Koh Young Zenith DS: Both Sides, One Pass 23.10.2026

At SMTA Guadalajara, Global SMT & Packaging spoke with Heriberto from Koh Young about the new Zenith DS dual-side AOI system. Two inspection heads check the top and bottom of a board simultaneously, combining SMT and through-hole inspection in a single pass to reduce inspection time and costs. The system is currently being showcased in beta, with software scheduled for Q1 2027. Koh Young is al...

PARMI’s Laser AOI: Faster Programming with AI 22.10.2026

Keith Bryant speaks with Juan Arango of PARMI about laser-based AOI and the growing role of AI in inspection. Arango explains how laser scanning avoids the shadows associated with white-light systems, helping improve inspection quality. According to PARMI, AI auto-programming cuts program creation from six to eight hours to under 10 minutes, followed by 10–15 minutes of debugging. For high-mix, lo...

Smarter Stencil and Nozzle Cleaning with Shenzhen Synergie 21.10.2026

Keith Bryant speaks with Thomas Yang of Shenzhen Synergie about closed-loop cleaning systems that combine cleaning, inspection and automatic re-cleaning in one machine. CCD cameras detect blocked stencil apertures and trigger additional cleaning where needed. Pick-and-place nozzles receive the same automated treatment, reducing reliance on manual microscope inspections. Each stencil and nozzle is...

Beyond the Sale: Supporting Mexico’s Manufacturers 21.10.2026

At SMTA Guadalajara, Keith Bryant speaks with Reuben from SMarTsol Technologies about why local service is essential to Mexico’s electronics industry. From manufacturer-certified engineers and spare parts to practical training, SMarTsol helps customers keep production running. As factories adopt more robotics, AI and semiconductor equipment, Reuben explains why technical expertise and long-term su...

Vacuum, nitrogen or formic acid: which reflow approach best fits your production needs? 19.10.2026

At SMTA Guadalajara, Keith Bryant brings together industry experts to explore the advantages and limitations of these reflow technologies, whether combining vacuum and nitrogen offers the best of both worlds, and what the future holds for reflow soldering. Joining the discussion: • Luis Antonio Garcia G. — Rehm Thermal Systems SA de CV • Paul Lancaster — HELLER INDUSTRIES, INC. • Bob Bouchard — Di...

Synergie expands its global reach with cleaning systems for electronics manufacturing. 16.10.2026

In this interview, Thomas Yang, owner of Shenzhen Synergies Machinery, introduces the company’s cleaning solutions for small parts, nozzles and stencils. Based in Shenzhen, China, Synergie supplies its systems through distributors in Mexico and Malaysia. Yang discusses the equipment, configuration options and international availability. Watch the video for a closer look at Synergie’s cleaning tech...

Innotronics introduces a 12-channel reflow profiler that measures vibration alongside the thermal profile. 15.10.2026

In this interview, S.P. Arora, Managing Director of Innotronics, discusses the new system and the company’s equipment portfolio for India’s PCBA manufacturing industry. From Panasonic and Essemtec solutions to storage systems and solderability testers, Arora explores the technologies Innotronics brings to manufacturers and its relationships with major OEMs. Watch the interview for a closer look at...

Rapidise reports 11X growth in just 18 months 14.10.2026

Brijesh Kamani, CEO of Rapidise, discusses the company’s rapid expansion, reporting a global workforce of 1,500 people and facilities in India, the USA and other locations. He explains how closer collaboration between design and manufacturing teams helps reduce revisions, minimize errors and accelerate time to market. Watch the full interview for insights into Rapidise’s approach to original desig...

Data I/O brings programming as a service to India 13.10.2026

At the NMTronics stand, Sid Singh of Data I/O speaks with Trevor Galbraith about the company’s updated product portfolio, including programming as a service, security provisioning and ConneX MES integration. The service places Data I/O systems, operators and maintenance at the customer’s site, charging per part programmed. This gives manufacturers access to device programming without a large upfro...

Essegi Automation takes component management closer to the SMT production line with its new pick-to-light racks. 12.10.2026

Manuel Bellin explains how the racks, positioned beside the pick-and-place machine, connect directly to Essegi’s Storage Towers and Goods Inward inventory system. The interview also covers how the storage towers work, component handling after production, component quality, and support from NMTronics. Watch the video to learn more, and like and subscribe for further electronics manufacturing update...

FUJI launch new entry-level to midrange CLT-FG mounter 08.10.2026

Kikuo Kondo and Yasuaki Masuda discuss the growth of FUJI in India, since partnering with NMTronics in 1999. The relationship relies heavily on coordinating support, training and future development together with feedback from Indian manufacturers. The latest machine, making its debut at the show, is the CLT-FG, which is aimed at the entry-level to mid-volume. It ultilises the same feeders and soft...

Koh Young expands its manufacturing capabilities for their global customer base 05.10.2026

Peter Shin runs South East Asia operations for Koh Young, based in Singapore. He explains the key markets in Asia and how the Koh Young are in strong demand among the hyperscalers and major manufacturers.

TRI expands geographically and launch new advanced packaging inspection equipment 25.09.2026

Robert Yebra talks about the geographical expansion of TRI and the product expansion into semiconductor advanced packaging. The company has already developed a wafer inspection system and will standardize a panel inspection model soon. TRI also manufacturers wire bond inspection equipment and die bond inspection.

iNeTEST expands into PCB and Advanced Packaging test solutions 25.09.2026

Soni Saran Singh discusses the 20 year history of iNeTEST and how it has evolved to deliver AOI, SPI, ICT, X-ray, Flying Probe and a wide range of other test solutions across the PCB assembly industry. The company plans to expand its activities to cover test solutions for PCB and semiconductor Advanced Packaging.

SEHO expand their presence in India with NMTronics 25.09.2026

Markus Walter talk about the recently anounced partnership between SEHO and NMTronics. The partnership will focus on sales and be supported by SEHO's exisiting team in India. Walter also discussed the wider footprint for SEHO in Asia.

NMT Automation evolves as a world class manufacturer of production equipment 25.09.2026

Soni Saran Singh tells the story of the evolution of NMT Automation. Under the "Make in India" scheme they started with conveyors and board handling systems and plan to expand this to semiconductor testing equipment. Singh also spoke at length about the talent acquisition and mentoring programs.

SPEA offer a wide range of end of line testers for PCBA and Advanced Packaging 25.09.2026

Luca Graglia explains why SPEA flying probers lead the market with linear motors and encoders. This level of speed and accuracy are well-suited to increasing miniaturisation in PCBA and advanced packaging. The company also manufactures bed of nails testers. They work with customers to advise which test methodology is best for them.

Comet Yxlon shows a strong footprint in India. 25.09.2026

Till Stegel is the Asia Sales Manager for Comet Yxlon. In India, the main models for the PCBA industry are the Cougar and Cheetah x-ray systems. The future roadmap for Comet Yxlon is focused on the semiconductor advanced packaging industry and further refining the accuracy, speed and versatility of their systems.

ASMPT debut the SIPLACE V 24.09.2026

ASMPT debuted the new SIPLACE V pick and place mounter. Originally shown for the first time at Productronica, Germany in November 2025, the platform is 30 percent faster than the TX platform, with a more compact footprint, producing 105K CPH at an accuracy down to 25 microns. This is the first machine in this series, which will eventually replace the TX and SX platforms. It uses the same feeders,...

India's PCBA Manufacturing Evolution Navigating the Shift from Domestic to Global 23.09.2026

As India transitions from a domestic-focused manufacturing base to an export-driven international model, Indian PCBA manufacturers face a pivotal moment. This panel explores the opportunities and obstacles shaping the industry's growth: scaling production to meet global standards, building supply chain resilience, competing with established players in key markets, attracting talent and investm...

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