I-Connect007

On the Line with...

On the Line with… Brought to you by I-Connect007. This exciting, new podcast features the latest and future trends having market impact in the electronics industry from the voices of experts.

Author

I-Connect007

Category

Technology

Podcast website

iconnect007.com

Latest episode

Jul 9, 2026

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Episodes

Meet the Author—The Printed Circuit Designer's Guide to UV Conformal Coatings: Addressing Future Manufacturing Speed and Need 09.07.2026

Authors Brian Chislea and Cody Schoener, PhD, share a conversation with Nolan Johnson on their latest book, "The Printed Circuit Designer's Guide to UV Conformal Coatings." Chislea and Schoener talk about why this book is so important now, and the advantages and applications for UV curable conformal coatings. Central to the discussion is how such coatings can simplify manufacturing,...

PCB Materials: What’s Next? Innovations Shaping the PCB Industry 30.04.2026

In the series wrap-up, Marcy LaRont discusses with CTO Kirk Thompson the turning point facing the PCB industry as innovation speeds up. With increasing data rates, power density, AI infrastructure, flexible electronics, photonics, and chiplet integration, traditional material assumptions are no longer enough. Kirk explains how advanced materials now enable higher speeds, better thermal management,...

PCB Materials: The Global Supply Chain—Lessons From Disruption 15.04.2026

Lessons learned from recent global supply chain disruptions. Drawing on recent events to shed light on current issues, Jim explains that many supply chain weaknesses experienced during the COVID-19 pandemic were structural, as geographic and supplier-base efficiency had been prioritized over resilience. However, achieving true resilience requires diversification, scenario planning, strategic inven...

Reliability Under Pressure—PCBs in Harsh Environments 01.04.2026

Marcy LaRont speaks with Laura Martin, Director of Strategic Markets at Isola, about PCB reliability in harsh environments across aerospace, automotive, and defense applications. Martin explains that reliability under pressure involves managing cyclic strain within composite materials—not just meeting temperature limits. Thermal cycling, Z-axis expansion, moisture under bias, and anisotropic behav...

The Green Circuit—Sustainability in PCB Manufacturing 19.03.2026

As each area of electronics and manufacturing take a more serious look at sustainability and end product circularity, the base material of the PCB should in central in that discussion. In this episode of On the Line with, Isola’s Kirk Thompson explains the “green circuit,” new directions in materials and engineering that address important environmental impact issues such as the amount of energy it...

5G, AI & Beyond—Designing for High-speed Performance 04.03.2026

It's no surprise to anyone that AI is transforming the rules of electronics, demanding speed, power, and frequency performance beyond what traditional electronics offer. Is AI rendering yesterday’s materials obsolete? In this episode of On the Line With, Isola's Drew Delaney offers a firsthand look at the materials science quietly powering everything from hyperscale AI data centers to 5G a...

Material Selection—The Key to Manufacturing Success 17.02.2026

The base laminate of a printed circuit board is its literal and functional foundation. Making the right material choice for your build is key to manufacturing success and product reliability. In this episode of On the Line With, Sean Mirshafiei from Isola talks about the critical role of PCB base material has played, and continues to play, in electronics manufacturing. As today's technology de...

Remtec: Ceramic Comes of Age in the Complex Design World 06.01.2026

Remtec president, Brian Buyea, leads us through ceramic as a board substrate, including a discussion of the ideal applications, technical advantages, and a customer story or two. Remtec's 35 years of manufacturing experience, along with a staff of qualified engineers, creates a deeply collaborative relationship with their customers.

Ultra HDI? It Depends 15.12.2025

In this episode, John Johnson wraps up this series with some frequently asked engineering questions about UHDI adoption and gives some tips on when it's the right time to look at UHDI as a manufacturing solution.

Beyond UHDI—The Future of PCB Technology 09.12.2025

So, what's in the future for UHDI? John Johnson imagines how UHDI technologies will change PCBs, fabrication, and the tools available to OEM designers.

UHDI for Medical Innovation 02.12.2025

Possibly the most life-critical application sector is medical devices. John Johnson explains how UHDI can not only improve reliability, but deliver multiple new sets of functionality to the medical instrumentation field.

Exploring Technology Market Dynamics and AI's Impact 25.11.2025

Inspection systems continue to find themselves at the center of the EMS manufacturing equipment evolution. Joel Scutchfield shines a three-dimensional light on what's driving the market, and a spotlight on Koh Young's latest companion guide to Brent Fischthal's book, "The Printed Circuit Assembler's Guide to SMT Inspection."

High-reliability Applications 19.11.2025

High reliability and sustainability are of increasing importance in the products we design and manufacture. How does Ultra High Definition Interconnect deliver on these key design constraints?

How Elephantech is Revolutionizing PCB Production 17.11.2025

In this episode of Voices of the Industry, Marcy LaRont sits down with Satoshi Konagai of Elephantech to spotlight the cutting-edge technology behind their early success. Konagai shares how the company’s unique additive manufacturing process is redefining PCB production—dramatically reducing material waste, lowering energy use, and minimizing environmental impact. And beyond sustainability, Elepha...

Materials, Up and Coming Capabilities 05.11.2025

Materials are the surface upon which all the interconnects are placed. If the material specification cannot accommodate UHDI, the boards will not be successful. John Johnson explains the implications of material choices for UHDI.

Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics 31.10.2025

Adhesives and coatings are responding to changing industry requirements in innovative ways. Doug Katze delivers a master class on adhesive technologies, their individual appeal in electronics manufacturing, and the market needs driving all this innovation.

Solder Mask: Beyond the Traces 28.10.2025

Solder mask: So easy to just gloss over this step but when UHDI is involved, you'd best not. John Johnson explains the crucial adjustments to be made even with solder mask in order to open up UHDI's full potential.

Testing Innovation: Advances in Test, Inspection & Failure Analysis 23.10.2025

Circuit test, inspection, and failure analysis are enjoying a rapid increase in capabilities and sophistication. Test companies, such as Datest, are capable of testing methods we could only dream of ten years ago. Learn how Datest uses their expertise to not only perform high-quality failure analysis, but also to become a valuable DFT resource for the design team.

What to think about beyond the traces: Copper Filling of Vias 15.10.2025

Continuing our discussion with ASC's John Johnson, we explore the pluses and minuses of copper plating microvias from the perspective of the fabricator and the designer.

What to think about beyond the traces: Via Structures 07.10.2025

Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.

Building Reliability: KOKI’s Approach to Solder Joint Challenges 07.10.2025

Solder joint reliability is essential to product performance and longevity in electronics. Failures can lead to costly repairs, dissatisfied customers, or even catastrophic loss, depending on the application. In this Voices of the Industry episode, Marcy LaRont talks with Shantanu Joshi of KOKI America about how advanced materials—such as crack-free fluxes and zero-flux-residue solder pastes—are h...

Ultra HDI: SWaP Considerations 30.09.2025

John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.

Optimize the Interconnect: Wrapping Up OTI 25.09.2025

In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.

How does Ultra HDI benefit: Routing Capabilities 24.09.2025

American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.

Meet the Co-Author of Low-temperature Soldering, Volume 2 23.09.2025

Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares...

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