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John Johnson leads the way straight into UHDI's benefits to RF style design.

To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.

Patrick Brooks discusses the role of wet processes—in conjunction with laser systems—in delivering on the “Optimize the Interconnect” idea. One example is Bondfilm, a unique coating that allows CO2 lasers to more effectively ablate copper than ever before.

Laser via drilling is a critical process window for MKS's Optimize the Interconnect concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.

MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.

We continue our conversation with Chris Ryder on the Optimize the Interconnect(SM) concept. Chris shares some specific examples and details how and why industry leaders are adopting the OTI approach.

Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for...

OTI, or "optimize the interconnect," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.

Martyn Gaudion spills the tea on his third book, sharing more secrets for successful high-speed design.

We continue our conversation with Ryan Miller, and we get practical about design and manufacturing techniques to manage thermal effects, including such structures as via farms, insulated metal substrates, coin technology, and copper pedestals.

Ryan Miller takes Nolan Johnson through strategies for managing heat that can be applied during the design planning and specification phases. Prevention means there is less to mitigate.

In this kickoff episode, Ryan Miller makes the case for why thermal management needs to be on the minds of the designers. But what are the main causes of excess heat in our designs today? Join us as we start by defining the problems, then turn to the array of solutions.

Scott Miller and Brian White join host Nolan Johnson to discuss Miller's book, The Printed Circuit Designer's Guide to Executing Complex PCBs. Miller and White add insight to the seven key disciplines required by designers to successfully design complex PCBs. Of course, in this fast-moving industry, they also provide updated perspectives.

In this episode, my guests are Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools. Univertools represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to Factory Analytics.” In this episode, we're discussing the evolving role of data analytics, with an eye toward how analytics is drivin...

The panel full of circuit boards has completed the manufacturing process. We end this journey by routing the panel into individual boards, performing a final inspection, and packaging for shipment.

Nearly finished, phase two of the wrap-up is to apply surface finish to protect that copper from oxidation and to facilitate soldering the components to the board.

By this point, we have a functioning PCB, but there is still more to do in order to keep the board safe from environmental effects, and also document the circuit components. In this episode, we cover the topics solder mask and silkscreen.

At this stage in the process, we have a panel comprised of all the internal layers laminated together, through-holes are drilled, and the outer layer copper features have been covered with a protective layer of tin. Join us as Matt Stevenson walks us through the process sequence for outer layer strip, etch, and strip.

Our series on Intelligent System Design continues with a discussion on integrating board data with mechanical data. Cadence's Vince DiLello joins us to remove the mystery of connecting PCB and mechanical design flows. DiLello explains the current state and describes what he sees in the future.

This is where fabrication gets wild—pattern plate. All the prep work has set up the board to receive the copper traces, pads, and other elements as specified by the designers in the original CAD design. Here, Matt Stevenson describes not only the process but many of the constraints in the chemistries that must be managed to deliver the customer's exacting manufacturing tolerances.

Product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.

Each circuit board is composed of a one-of-a-kind pattern of metal connections representing the specific design for that circuit. So, how do those unique features get mapped onto the board? Find out in this episode as Matt Stevenson paints a picture of the outer layer imaging process.

In this episode, we continue the theme of bringing more decision-making power to the design process. This time, we're talking with Supreeth Mannava about bringing more "power" (and "signal") to the electrical engineer.

Now it's time to start getting into the chemistry! In this episode, Matt Stevenson describes the first key step in turning design data into physical reality - preparing the circuit board substrate material for fabrication. It's not as straightforward as you might think.

Cadence's Brad Griffin joins us in this episode where we discuss how an intelligent system design methodology can move some signal and power integrity decision making into the physical design space, offering real-time feedback.