3D InCites Podcast

The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT • Calv...

Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical...

What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona.  Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle...

Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this f...

The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipm...

Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies. Dariu...

This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.  They discuss the transition from 2D to 3D measurements in semiconductor manufacturing.  Zahn explains why  non-destructive, optical 3D measurements offer precise hei...

This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence , ERS Electronic , KLA , and Semilab .  It also features updates from Comet Yxlon , Trymax Semiconductor , and DSV-IMS . SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry. James McGrath from KLA discussed his...

In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal.  John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase...

This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure. Frede...

It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress.  First up is Dan Berger,  National Advanced Packaging...

On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These in...

For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors.  She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized.  It involves sourcing dies and chiplets from traditional foundries and applying semico...

Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies.  Brendan Wells , Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses h...

At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts.  In this episode, Françoise sits down with three of the award winners to talk about their I...

This episode was recorded live at the IMAPS International Symposium in Boston MA.  Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD.  Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importan...

In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.    HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps...

In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves.  von Trapp and Drolz explore the evolution of...

In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging. McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas;  his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to it...

In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?     In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advan...

In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of  The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024.  This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onsho...

In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it.  They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having...

In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.  The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on t...

This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development.  Today’s guests will address both these topics. Paul Kelly, Vice President of Strategies, Partnerships, & Ne...

The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows. The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly calibrated, sensitive equipment? There are many moving parts to...