Global SMT & Packaging
Global SMT Podcast
Global SMT & Packaging APP, BLOG, PODCAST, Websites, Newsletters, Magazines, Videos and Social Media platforms (Facebook, Twitter, Linkedin, YouTUBE) are a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials, 3D Printing, SMT – Surface Mount Technology, OTS – Open Technology Solutions, SFS – Smart Factory Solutions, IPC – Institute for Printed Circuits. These sources also give you exclusive access to CEO interviews, webinars, white papers, new products, panel discussi...
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Global SMT & Packaging
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Latest episode
Jun 30, 2025
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Episodes
Tech Talk - Joel Scutchfield from Koh Young 19.10.2023 16:09
Interview with Joel Scutchfield from Koh Young
Tech Talk from SMTAI 2023 - Day 1 18.10.2023 24:37
SMTAI 2023 - Day 1
SMTAI 2023 - Show Roundup 17.10.2023 7:54
SMTAI 2023 - Show Roundup
Tech Talk from SMTAI 2023 - Day 2 16.10.2023 21:34
Tech Talk from SMTAI 2023 - Day 2
Panel Debate – The use of AI in MES Systems 12.10.2023 22:58
Panel Debate – The use of AI in MES Systems
Tech Talk at SMTAI Minneapolis 2023 10.10.2023 24:37
Tech Talk at SMTAI Minneapolis 2023
IGUS at Semicon West 2023 09.10.2023 9:14
IGUS at Semicon West 2023
Productronica India - Kaynes Technology - The first 30 years 06.10.2023 8:02
Productronica India - Kaynes Technology - The first 30 years
Panel Discussion - The EMS manufacturing landscape in India 06.10.2023 10:19
Panel Discussion - The EMS manufacturing landscape in India
Global Viewpoint for October 2023 05.10.2023 4:18
Global Viewpoint for October 2023
Terecircuits revolutionize high volume pick and place and SiP assembly 24.08.2023 17:42
In an intriguing Tech Talk interview, Terecircuits have developed a polymer carrier that can pickup large amounts of devices in one pass and use a high-powered UV laser to deposit them with high accuracy on the substrate. The polymer material vaporizes during the process. In a separate develop, the same technology is being used to assemble chiplets in SiP Devices without the use of solder.
Interview with Stephan Haferl, CEO at COMET Group 28.06.2023 17:03
Stephan Haferl, CEO of COMET AG joins Trevor Galbraith to discuss the technology milestones, both past, present and future that continues to make the COMET Group one of the most innovative technology companies and solution providers across the semiconductor, backend packaging and PCBA sectors.
Tech Talk – Season 5 Episode 15 – Robots, Cobots and Automation 08.03.2023 17:27
Tim DeRosett, Product Manager at Brooks Automation discusses the applications and benefits for using collaborative robots (cobots) in PCBA assembly.
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