Fexingo

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

Business EN ↓ 104 episodes

Lucas and Luna sit down at a lab bench cluttered with oscilloscopes and prototype boards to talk about the engineering decisions that shape the chips powering modern life. Each episode takes one piece of hardware — a new RISC-V core, a GaN power amplifier, a MEMS accelerometer — and examines its design trade-offs, yield challenges, and market positioning. They discuss why Intel’s 20A node matters for foundry customers, how TSMC’s CoWoS packaging affects AI accelerator supply, and what the CHIPS Act subsidies mean for domestic fab construction. Lucas brings the component-level knowledge (thresh...

Author

Fexingo

Category

Business

Podcast website

www.fexingo.com

Latest episode

Jul 11, 2026

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Episodes

Why Chip Designers Are Adopting Liquid Cooling 16.06.2026

Episode 54 of The Hardware Podcast dives into the quiet shift from fans to liquid cooling in high-performance chips. Lucas and Luna explore why a single AI accelerator now draws over 1000 watts, how direct-to-chip liquid cooling works, and what the transition means for data center design, energy costs, and future chip architectures. Using specific examples from recent hyperscaler deployments and c...

Why Chip Designers Are Embracing Heterogeneous Integration 15.06.2026

On today's Hardware Podcast, Lucas and Luna explore heterogeneous integration — the chip design strategy that stacks silicon, III-V compounds, and photonics into a single package. They break down how this approach enabled AMD's MI300X AI accelerator, which combines nine chiplets on a single interposer to rival NVIDIA's flagship GPU. The hosts discuss the technical challenges of mixing different pr...

Why Chip Designers Are Rethinking Power Delivery Networks 15.06.2026

Episode 52 of The Hardware Podcast dives into the hidden grid inside every chip: the power delivery network, or PDN. Lucas and Luna explore why traditional on-chip power grids are hitting a wall as transistors shrink below 3 nanometers, and how the industry is turning to a radical alternative called 'buried power rails.' Anchored by a real-world example from a recent IEEE paper on Intel's 18A proc...

How Chips Are Learning to Rewire Themselves 14.06.2026

Episode 51 of The Hardware Podcast explores the emerging field of runtime-reconfigurable logic. Lucas and Luna dive into how a startup called FlexLogix is embedding reconfigurable data-path units inside server chips, allowing the chip to rewire its own circuits while the system is running—no new silicon needed. The discussion centers on a real deployment at a major cloud provider where reconfigura...

Why Chips Are Getting a Dedicated Security Co-Processor 14.06.2026

Episode 50 of The Hardware Podcast dives into the rising trend of on-chip security cores — dedicated hardware engines that handle encryption, attestation, and key management separately from the main CPU. Lucas and Luna explore why Apple's Secure Enclave, Google's Titan M, and AMD's Platform Security Processor signal a fundamental shift in chip design. They unpack the numbers: a modern server chip...

The Quiet Revolution in Chip Substrates 13.06.2026

Lucas and Luna dive into the unsung hero of chip performance: the substrate. They explore how Intel's glass substrate breakthrough is reshaping the race for faster, cooler, and more efficient processors. With real-world examples like AMD's EPYC and NVIDIA's GB200, they unpack the materials science, supply chain implications, and why the substrate might be the next frontier in Moore's Law. #ChipSub...

Why Chip Designers Are Embracing Multi-Die Simulation 13.06.2026

Episode 48 dives into the growing complexity of simulating multi-die chip designs, where chiplets and advanced packaging create new verification challenges. Lucas and Luna explore how EDA tools are evolving to handle system-level thermal, power, and signal integrity issues that single-die designs never faced. With specific data on simulation time blow-ups and real examples from the latest design f...

Why Chip Designers Are Turning to Carbon Nanotube Interconnects 12.06.2026

Episode 47 of The Hardware Podcast digs into the quiet shift happening inside chip fabrication lines: carbon nanotube interconnects. Lucas and Luna discuss why copper interconnects are hitting fundamental limits at the 2-nanometer node, how carbon nanotubes can carry more current with less resistance, and what TSMC and IBM have disclosed about their early research. They walk through a specific 202...

Why Chip Designers Are Betting on DRAM in the Package 12.06.2026

As memory bandwidth becomes the bottleneck for high-performance computing, chip designers are moving DRAM from the motherboard into the same package as the processor. This episode explains the technology behind high-bandwidth memory (HBM), how it stacks memory dies vertically with through-silicon vias, and why it challenges traditional DDR. Lucas and Luna break down the specific engineering trade-...

Why Chip Designers Are Adopting Silicon Photonics 11.06.2026

Episode 45: Lucas and Luna explore the emerging field of silicon photonics—using light instead of electricity to move data inside chips. They break down a real-world case: a startup called Ayar Labs has demonstrated an optical I/O chiplet that transfers data at 4 terabits per second while cutting power consumption by 80 percent compared to traditional copper interconnects. The hosts explain how th...

Why Chip Designers Are Racing to Embrace Glass Substrates 11.06.2026

Episode 44 of The Hardware Podcast dives into the quiet but transformative shift happening inside chip packaging labs: the move from organic laminates to glass substrates. Lucas unpacks the physics—why glass offers better dimensional stability, lower signal loss, and the ability to pack more chiplets in a single package. Luna brings a concrete example: Intel's 2025 announcement of a glass-substrat...

Why Chip Designers Are Switching to Open-Source RISC-V 10.06.2026

Episode 43 of The Hardware Podcast dives into the open-source RISC-V instruction set architecture, which is gaining traction from tiny IoT controllers to server-class processors. Lucas and Luna break down why companies like NVIDIA, Alibaba, and the Chinese government are betting on RISC-V, how it challenges Arm's licensing model, and what a $1.5 billion venture investment means for the future of c...

The Most Expensive Material Inside a Chip Factory 10.06.2026

Episode 42 of The Hardware Podcast dives into a material most people have never heard of but is absolutely critical to every chip ever made: photoresist. Lucas and Luna explore why a single gallon of the high-end photoresist used in extreme ultraviolet lithography can cost over $2,000 — more than gold by weight. They break down the chemistry, the purity requirements that make it so expensive, and...

The One Test That Decides If a Chip Ships 09.06.2026

Every chip that ends up in a smartphone, car, or data center passes through a single high-stakes checkpoint called final test. This episode goes inside the multi-million-dollar test floor at a typical OSAT facility — think Amkor or ASE — where handlers sort good dies from bad at speeds of tens of thousands per hour. We look at how the industry is coping with the explosion of test time as chips get...

The Race to Make Chips That Fix Themselves 09.06.2026

Chip defects cost the semiconductor industry billions every year. But a quiet revolution in built-in self-test circuitry is changing the economics of reliability. Lucas explains how chips can now run their own health checks, diagnose faults, and even reconfigure around broken cores — all without external test equipment. Luna pushes back on whether this adds too much complexity. Using examples from...

The Unsung Hero Behind Every Chip Lithography Step 08.06.2026

Semiconductor manufacturing gets all the glory for extreme ultraviolet lithography and nanometer-scale transistors, but there is a less glamorous step that happens dozens of times per chip: the photomask. In this episode, Lucas and Luna explore how photomasks act as the precision stencils that define every circuit layer, why a single defect smaller than a virus can ruin an entire batch, and how th...

How EUV Lithography Machines Make the Smallest Chips Possible 08.06.2026

In this episode of The Hardware Podcast, Lucas and Luna dive into the engineering marvel behind extreme ultraviolet lithography—the machines that print the world's tiniest transistors. They explain why EUV light is generated by vaporizing tiny droplets of tin with a laser, how mirrors replace lenses because UV light can't travel through glass, and the staggering precision required to align layers...

Why Chip Designers Are Betting on Chiplets 07.06.2026

Episode 37 of The Hardware Podcast dives into the chiplet revolution — why major chipmakers are moving away from monolithic dies and stitching together smaller silicon tiles instead. Lucas explains how AMD's Zen architecture proved the model with its Zen 2 chiplet design, using four compute dies plus an I/O die on a single package. Luna questions the cost and complexity trade-offs, from interconne...

Why Chip Designers Are Betting on Advanced Packaging 07.06.2026

In Episode 36 of The Hardware Podcast, Lucas and Luna explore the quiet revolution in chip packaging that is extending Moore's Law. They explain how 2.5D and 3D packaging allow designers to combine chiplets from different process nodes, boosting performance without shrinking transistors. The hosts walk through a real example: how an AI accelerator uses interposers and hybrid bonding to stack memor...

Why Chip Teams Are Rethinking On-Chip Memory 06.06.2026

Episode 35 of The Hardware Podcast with Fexingo dives into the quiet revolution happening inside chip design: the shift away from traditional SRAM toward new on-chip memory architectures like embedded DRAM and resistive RAM. Lucas and Luna explain why memory now consumes 40 to 60 percent of chip area in a typical processor, and why the old cache hierarchy is breaking down. They explore a concrete...

The Hidden Economics Behind Chip Packaging 06.06.2026

In Episode 34, Lucas and Luna unpack a quiet revolution that rarely makes headlines: advanced chip packaging. While everyone obsesses over transistor shrinks, the way chips get physically assembled is becoming a bottleneck and an opportunity. Lucas explains why TSMC's CoWoS packaging is suddenly critical for AI accelerators, how Intel is betting on Foveros, and why the cost per extra millimeter of...

The Thermal Interface Material Keeping Your Chip Cool 05.06.2026

Every chip generates heat, but the material that moves that heat from the silicon to the heatsink rarely gets attention. In this episode, Lucas and Luna dive into thermal interface materials — the paste, pads, and liquid metals that sit between your CPU and its cooler. They break down how thermal conductivity is measured in watts per meter-kelvin, why a 1-micron air gap can kill performance, and w...

The One Decision That Determines Every Chip Architecture 05.06.2026

Every chip design starts with a single high-stakes choice: which instruction set architecture to build on. This episode of The Hardware Podcast with Fexingo walks through why that decision shapes everything from performance to software ecosystem, with a close look at ARM's rise against x86 in data centers and how RISC-V is shaking up the landscape. Lucas and Luna break down the trade-offs between...

What Happens When Chip Interconnects Hit a Wall 04.06.2026

Lucas and Luna dig into the quiet crisis brewing inside every advanced chip: the interconnect bottleneck. As transistors shrink toward the atomic scale, the tiny wires that carry data between them are becoming the dominant limiter on performance and power. They break down why copper is struggling, what materials like cobalt and ruthenium might replace it, and how a shift to 'backside power deliver...

The Tiny Precision of Chip Testing Probes 04.06.2026

In this episode of The Hardware Podcast with Fexingo, Lucas and Luna explore the unsung hero of chip manufacturing: the microscopic probe card that tests every single chip before it leaves the factory. They dive into how these needle-thin contacts must align with nanometer precision, the challenge of testing 10,000 pads per second, and what happens when a single probe breaks. Lucas explains why pr...

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