IMAPS

3D InCites Podcast

As a semiconductor industry community, IMAPS 3D InCites content platform and podcasts brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The IMAPS 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that...

Author

IMAPS

Category

Technology

Podcast website

www.3dincites.com

Latest episode

Dec 11, 2025

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Episodes

Tom Sonderman of SkyWater Talks about Growing the Semiconductor Workforce 22.06.2023

In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry. Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over the world to meet the gr...

Member Spotlight: What Happened at ECTC 2023 15.06.2023

The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals.  Rozalia Beica and Venkata Mokkapati, AT&S talk about the important role advanced IC substrates have in today’s...

ECTC 2023: Key Takeaways from the Keynote and Panels, Changes and Future Plans 08.06.2023

In this episode, recorded live at ECTC 2023, Françoise interviews some of the key speakers about the hot topics of the week: Quantum computing, the Chips and Science Act, and workforce development. Additionally, she speaks with the winner of the first-ever, IEEE EPS William Chen Distinguished Service Award. The episode concludes with a conversation with the event organizers about changes and futur...

SEMI's Joe Stockunas Talks about Changes for SEMICON West 01.06.2023

We are just about 5 weeks away from the biggest event of the year for the semiconductor industry – SEMICON West, which takes place July 11-13 at the Moscone Center in San Francisco.  This annual event is the flagship of SEMI. The days are packed with conference sessions, the show floor showcases the latest and greatest technologies, the special pavilions are humming with activity, and the networki...

imec’s Cédric Rolin Talks about the Sustainable Semiconductor Technologies and Systems Research Program 25.05.2023

 Continuing our focus on sustainable semiconductor manufacturing, in this episode Françoise speaks with Cédric Rolin , project manager at imec, about its Sustainable Semiconductor Technologies & Systems (SSTS) research program. Launched by imec in 2021, the SSTS rallies stakeholders from across the semiconductor industry to help reduce the ecological impact of the IC value chain.   In response...

SEMI MIT Discusses the Electronic Design Market Data Report 11.05.2023

In this fourth episode of the SEMI MIT podcast series, you’ll learn about the semiconductor device design market, the latest SEMI Electronic Design Market Data (EDMD) report, and the Electronic System Design Alliance (ESDA) whose members contribute to it. Speakers include:  ·        Paul Cohen , Senior Program Manager of ESDA ·        Bob Smith , Executive Director of ESDA ·        David Ghodsizad...

SEMI Start Up Series Episode 3: The Role of the Venture Capital Companies 04.05.2023

In the first two episodes of this series, we heard from startup finalists who participated in last year’s program about their sustainability solutions, their experience with the program – including making strong industry connections and some securing funding, and advice for startups participating this year.   In this third and final episode of the SEMI Startups for Semiconductor Sustainability ser...

Andy Mackie Talks About His Decoder Ring for Semiconductor Packaging 27.04.2023

In this episode, recorded at IMAPS DPC 2023, Françoise von Trapp talks with Indium’s Andy Mackie, about his latest mission to address the confusing and complex lexicon of Advanced Packaging technology.  He shares the backstory on the idea, he has come up with to change the way we talk about semiconductor device packaging, that will uplevel the importance of what is really interconnect technology. ...

SEMI ISS Europe Panel: Closing the Talent Gap and Cultivating the Workforce of Tomorrow 25.04.2023

In this special episode of the 3D InCites Podcast, we bring you, in its entirety, a panel discussion that took place earlier this year at SEMI ISS Europe. The theme: Closing the Talent Gap and Cultivating the Workforce of Tomorrow. The multigenerational panel offers different perspectives and multiple topics, such as what they look for in a company, the importance of workplace culture, and what th...

DEI: It Takes A Village - A Panel Discussion 20.04.2023

At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that people might be asking: Why should I care? Why do I need to use my pronouns? What can...

Member Spotlight: What We Presented and What We Learned at IMAPS DPC 2023 13.04.2023

In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March.  Topics of discussion include: Using AI in microelectronics manufacturing, how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage,  and ad...

From IMAPS DPC 2023: Keynote Speakers Explore the EU Chips Act, Automotive Electronics, and Photonics Packaging 06.04.2023

This episode features interviews that were recorded live at IMAPS DPC 2023.    First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study . Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from h...

From IMAPS DPC 2023: Demystifying Chiplets with Keith Felton, Chris Scanlan, and Choon Lee 30.03.2023

At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.   You’ll hear fro...

Conversations with Winners of the 2023 3D InCites Award Winners 23.03.2023

In This episode, Françoise von Trapp interviews some of the 2023 3D InCites Award Winners, to learn about the significant accomplishments they are being recognized for.    First is James Bear , TEL, who describes some of the company’s best practices that helped them secure the 2023 3D InCites Sustainability Award. Engineer of the Year, Markus Leitgeb , AT&S, explains the concepts and advantage...

SEMI Start Up Series Episode 2: Wastewater, Gas Purification, and Circularity 09.03.2023

In this second episode of the SEMI’s Start-ups for Sustainability podcast series, SEMI’s James Amano returns to provide a quick recap of the program as SEMI gears up for its Startups for Semiconductor Sustainability Pitch Event Year 2.   This year’s focus is on start-up companies that provide solutions that address the challenges of semiconductor manufacturing emissions, energy issues, and circula...

What's Happening at IMAPS DPC 2023: Another Conversation with Beth Keser and Jim Haley 02.03.2023

Continuing the tradition started in 2022, Françoise sits down again with Beth Keser, sitting IMAPS president, and Jim Haley, VP of marketing, IMAPs, to talk about this year's IMAPS Device Packaging Conference, which takes place March 14-16, 2023 at WeKoPa Resort and Casino in Fountain Hills Arizona. Get ready for an action-packed week in this desert oasis at the foot of the McDowell Mountains...

SEMI Start Up Series Episode 1: What is the Sustainability Start Up Program? 16.02.2023

These days, everyone is talking about the importance of sustainability. In the semiconductor industry, developing more sustainable practices is top of mind for most manufacturers, because they are challenged with meeting increasing demands as semiconductors have become critical to everyday life, yet manufacturing them puts a strain on natural resources.  To address this, The SEMI organization put...

ICYMI: Bill Chen and the Heterogeneous Integration Roadmap 02.02.2023

Welcome to 3D InCites In Case You Missed It Series. We did a lot of podcasting in 2022. Some of our longer episodes consisted of multiple interviews, so you may have missed some of the juiciest conversations. So when there’s a break in the action, we’re taking you back to those conversations. In this episode, we’re going back to ECTC 2023, where Françoise sits down with ASE Fellow, Bill Chen , who...

A Conversation with SEMI’s Market Intelligence Team about ISS 2022 and the Semiconductor Manufacturing Monitor 19.01.2023

For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing Monitor, a report jointly developed by SEMI and T...

A Conversation about the Future of Semiconductor Packaging and Test in Europe 15.12.2022

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test.  Krö...

A Conversation about Leveraging Generational Differences in the Shifting Workplace 08.12.2022

In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace . The panel comprised industry professionals representing different generational cohorts, from...

SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New 01.12.2022

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and t...

Keynote Conversations from SEMICON Europa about Technology Advancements, Sustainability, and Workforce Development 24.11.2022

This podcast episode was recorded live at SEMICON Europa 2022, in Munich Germany. It features interviews with select keynote speakers representing the depth and breadth of topics discussed throughout the week.  Luc Van den hove , President and CEO of imec, in Belgium talks about the rollercoaster ride we’ve been on in the aftermath of the pandemic, the war in Ukraine, the subsequent energy crisis,...

A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging 10.11.2022

In this episode, Françoise speaks with Beth Keser, Ph. D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.  Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Tech...

A Conversation about Addressing Material Challenges for Electric Mobility Technology 03.11.2022

According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before E...

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